About Us

Founded in 2020, Seed Semiconductor is a high-tech enterprise specializing in wet-process technologies for pan-semiconductor materials, integrating the research and development, manufacturing, and sales of ultra-thin flexible glass (UTG) core processes. The company possesses industry-leading technological capabilities in silicon-based flexible material processing and UTG manufacturing, with proprietary wet chemical production processes and hybrid cutting/forming technologies. Its product yield rate and performance are at the forefront of the industry. Seed Semiconductor has established large-scale production bases in Hangzhou and Yancheng, with a monthly UTG production capacity exceeding 700,000 pieces. The company has achieved stable supply partnerships with major domestic display panel manufacturers, and its products are widely used in emerging consumer electronic devices such as foldable smartphones and AR equipment. While continuously deepening its presence in the consumer electronics sector, the company is actively expanding into diversified application scenarios, focusing on advanced semiconductor packaging and new material technologies. Its strategic includes Through-Glass Via (TGV) technology, microchannel liquid cooling solutions, and the exploration of lightweight solar wing materials that combine flexible UTG with space photovoltaic technologies for aerospace applications. Looking ahead, Seed Semiconductor will continue strengthening its core process capabilities and industrialization capacity, striving to become a globally leading provider of pan-semiconductor materials and advanced process solutions.