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Consumer Electronics

UTG Diaphragms

High Rigidity:The exceptionally high Young’s modulus of UTG enables the diaphragm to move as a rigid piston-like structure, effectively suppressing breakup vibration to deliver purer sound reproduction, clearer imaging, and reduced distortion at the source.Lightweight Design:The micron-level ultra-thin manufacturing process achieves extremely low surface density and minimal diaphragm inertia, allowing ultra-fast start and stop response. This provides outstanding sound speed and clarity while delivering extended, delicate high-frequency performance.Composite Structure:The innovative composite structure combining a “flat UTG glass diaphragm + PU flexible surround” perfectly balances rigidity and flexibility. It delivers the analytical performance of planar headphones while retaining the dynamic low-frequency response of traditional dynamic-driver earphones.Compared with other diaphragm materials, UTG glass achieves an exceptional balance between high rigidity and low density, effectively overcoming the drawbacks of titanium alloy diaphragms (high weight), PET diaphragms (high distortion), and bio-diaphragms (poor consistency). Combined with advanced composite structure design, UTG represents an ideal next-generation diaphragm material for premium dynamic-driver headphones.

Chemical Etching

We have pioneered the exclusive F.L.C.E cutting technology adopting an all-chemical thinning process, achieving a major breakthrough in wet processing technology for general semiconductor materials.Thinning Method: Horizontal single-sided top sprayingOriginal Material Thickness: 0.07mmTarget Thickness: 0.032mmThickness Tolerance: ±3μmProduction Capacity: 10K pieces per monthEquipped with 2 horizontal top-spray production lines, the total capacity reaches 20K pieces per month.

Yellow-Light AG (Anti-Glare) Glass

In the semiconductor yellow light zone, micro-nano spherical pit arrays are fabricated on the surface of glass or panels through sophisticated photolithography and etching processes, delivering premium anti-glare performance."Yellow Light" derives from the photolithography process in the semiconductor yellow-light zone, referring to high-precision micro-nano processing conducted in a yellow safe light environment without ultraviolet rays."AG" stands for Anti-Glare.Technical essence: Uniform and high-precision micro-nano spherical pit arrays are formed on the surface of glass covers via photolithography and etching processes.Bionic Nano Moth-Eye Optical Display TechnologyIt bionically mimics the orderly arranged nano-scale hexagonal structure of moth eyes, and fabricates subwavelength, nano-sized microstructure arrays on glass substrates. With structural dimensions smaller than the wavelength of visible light, a gradient refractive index interface is constructed to realize physical-level anti-reflection and transmittance enhancement.

Foldable Smartphones · Foldable Laptops

Based on its core silicon-based flexible material processing technologies, Seed Semiconductor has independently developed its proprietary FLCE process for foldable ultra-thin flexible glass manufacturing, enabling UTG product yield rates exceeding 90%.Each finished glass sheet supports smaller bending radii and has been tested to withstand nearly 10 million repeated folds. The products are suitable for manufacturing flexible OLED displays with outstanding optical performance and extended service life, widely applicable in foldable smartphones, foldable laptops, flexible automotive displays, and related products.UTG demonstrates significant advantages in:Flexibility and bending performanceWater and oxygen barrier propertiesMaterial durability and reliabilitySeed Semiconductor utilizes automated UTG production lines supported by intelligent unmanned auxiliary systems, enabling scalable mass production. The company currently operates two mass-production lines with a total production capacity of 1 million pieces per month.

AR glasses

AR glasses utilizing ultra-thin flexible glass (UTG) replace traditional resin lenses, enabling lighter, thinner, and more durable wearable devices. Combined with high-transmittance waveguide technology, the solution delivers clearer imaging and a more comfortable wearing experience.UTG offers excellent strength and flexibility while maintaining lightweight characteristics and enhanced optical performance. When integrated with waveguide modules, AR displays achieve greater stability and brightness, providing strong support for immersive visual interaction experiences.

Flexible Automotive Displays

Glass covers with excellent touch feeling and superior optical performance have become one of the mainstream material choices for automotive display covers. Featuring bendability, wide temperature resistance, high contrast and other advantages, they can better meet the demands for large-area in-vehicle display, intelligent entertainment and driving safety, and perfectly align with the development needs of next-generation smart cockpits and autonomous driving. Advantages of Flexible In-Vehicle GlassEnhance design freedom with stronger aesthetic and technological appeal.Better ergonomic performance; curved screens deliver superior display effects.Curved surface design helps optimize tactile feedback.

Semiconductor Packaging

Through Glass Via Advanced Packaging

What is a glass substrate? How does it differ from ordinary substrates?A glass substrate replaces traditional plastic substrates. It enables the formation of finer circuits, and features excellent heat resistance and bending resistance, which facilitates large-scale commercial application.Restricted by inherent physical properties, conventional substrate materials consume more power and are prone to expansion and warpage. In contrast, glass substrates are better suited to meet future industry demands. Why have glass substrates become a high-profile technology?As Moore’s Law gradually approaches its limit, semiconductor manufacturers are shifting from 2D to 3D architecture. By adopting chip stacking and advanced packaging technologies, the industry continues to increase transistor counts for enhanced performance, making packaging a critical link in the process. Amid this trend, Intel has unveiled the industry’s first glass substrate designed for advanced packaging, breaking traditional technical constraints, with mass production scheduled between 2026 and 2030.What glass packaging substrate products does Side offer?A wafer refers to a silicon chip used for the fabrication of silicon semiconductor integrated circuits. Various circuit components and structures can be processed on silicon wafers to produce integrated circuits with specific electrical functions.Leveraging proprietary etching technologies and advanced processing techniques, Side maintains strict geometric tolerance control. Its high-precision ultra-thin structured glass wafers are applicable to high-precision and high-accuracy components. Custom thickness solutions are available within an ultra-thin thickness range to meet customized production requirements.

Microchannel Active Liquid Cooling

Microfluidic liquid cooling technology is an efficient heat dissipation solution that delivers cooling fluid directly into chips or electronic devices through micro-scale channels (typically ranging from several microns to hundreds of microns). Leveraging the high specific surface area of microchannels and precise fluid control, it enables high-efficiency thermal management for devices with high power density.High-efficiency Heat DissipationLarge specific surface area of microchannels: greatly expands the contact area between cooling fluid and heat-generating components.Proximity to heat sources: microchannels can be arranged close to or even directly embedded in the heat-generating areas of chips to cool at the source and effectively reduce thermal resistance.Precise flow control: intelligent systems accurately regulate the flow rate and path of cooling fluid to achieve targeted heat dissipation for hot spots.This technology is also widely applied in multiple fields including biotechnology, chemical analysis, medical diagnosis and environmental monitoring.

Solar Wings

Aerospace Solar Wings

With the rapid development of the commercial aerospace industry, the number of satellite launches continues to increase, placing higher demands on space energy systems. Improving satellite energy efficiency under limited rocket payload capacity depends heavily on the lightweight design and efficient deployability of solar wing materials. Traditional solar cell modules are gradually becoming a bottleneck for satellite performance due to their weight and structural volume limitations. As a result, high-strength, foldable, and lightweight space-grade glass materials are emerging as a key technological direction in the commercial aerospace sector.The “multi-satellite launch per rocket” model also imposes extremely high requirements on solar wing storage volume, with compression ratios exceeding 100:1. Flexible materials have therefore become a core requirement for next-generation satellite energy systems.Seed Semiconductor has innovatively developed a space solar wing solution integrating flexible UTG (Ultra Thin Glass) with space photovoltaic technology. While maintaining the excellent optical properties and structural stability of glass, UTG achieves ultra-thin thickness and rollable structures, effectively reducing system weight and improving power generation efficiency.